Technical Capabilities

STENCIL LESS PRINTING - SOLDER PASTE JET PRINTING TECHNOLOGY

• This new process has been developed especially for high density PCB Designs

• Each surface mount pad can be given exactly the correct amount of solder paste

• No stencil to board gasketting issues therefore no risk of smear and hence solder balls

SURFACE MOUNT

• 4 SMT lines including on machine device checking.

• We can place down to 01005 package size, fine pitch BGA and Micro BGA, QFPs, DFN’s, CSP’s, CLCC’s.

• We also offer hand build SMT for low volume new products.

• Ersascope BGA inspection

• Infrared BGA rework station

CONVENTIONAL ASSEMBLY

• All Assembly is carried out by our fully trained experienced operators using the latest assembly techniques to a minimum of IPC 610 Class 3.

• All products are fully inspected using quality control plans.